Product Specifications: PC2023AB
Tough-Seal 23 is a tough and durable fast gelling Potting Compound and Sealant with excellent Thermal Cycling Stability. Tough-Seal 23 is a high viscosity, Glob Top material with a toothpaste like thickness. This allows for isolated or localized potting as well as perimeter damming of PCB’s and electronics not assembled in housings. Since sensitive components can be selectively potted, this is the perfect choice for radio frequency applications where RF signals cannot be interrupted.
Tough-Seal 23 has a 10-20 minute working time and a Shore Hardness of 64A, which is similar to the hardness of a car tire. Tough-Seal 23 reaches 94% of its full hardness after an overnight cure or with a heat cure of 1 hour at 80°C (176°F). Tough-Seal does not exotherm or shrink during curing, therefore there is no embedment stress induced on the electronic components that could cause damage and failure of the PCB or electronic assemblies. Sensitive electronics can be potted safely with low embedment stress Tough-Seal.
With a high elongation of 225% when fully cured, Tough-Seal 23 maintains exceptional flexibility and thermal cycling stability from –40°C to 150°C (-40°F to 302°F) without pulling back, wilting, or cracking. This ensures a tough seal that will stop moisture or other contaminants from damaging sensitive PCB’s and electronics.
Tough-Seal has very aggressive adhesion to aluminum, making it a perfect choice for potting aluminum housings. Tough-seal also bonds extremely well with most polymers. For housing and wire insulation materials that are exceptionally difficult to bond to, we offer our KEY PR1200 PRIMER, an aggressive adhesive promoter that is simple to use.
Technical Data Sheet (TDS) and Safety Data Sheet (SDS) Downloads
PLEASE SEE SDS OR CONTACT KEY POLYMER FOR MORE INFORMATION